Fundamentals of Device and...
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Fundamentals of...
Marc J Madou
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Fundamentals of Microsystems...
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Semiconductor Advanced...
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3D IC Integration and...
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Physical Design Essentials:...
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System on Package:...
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Portable Consumer Electronics...
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Semiconductor Packaging:...
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Thermal stress and strain in...
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Microelectronics Packaging...
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Advanced Electronic Packaging...
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3D IC Stacking Technology
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RF Measurements of Die and...
Scott A Wartenberg
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Mems and Microsystems: Design...
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Integrated Circuit Packaging,...
William Greig
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Microelectronics Packaging...
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Adhesion in Microelectronics
K L Mittal,
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Antenna-In-Package Technology...
Duixian Liu,
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Flip Chip Technologies
John H Lau
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Area Array Packaging Processes
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Liquid Cooling of Electronic...
Frank P Incropera
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Microelectronics Packaging...
R R Tummala,
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Area Array Packaging Handbook...
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Gilleo Ken
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