Area array packaging, comprising the use of ball grid array (BGA), chip scale package (CSP) and flip chip (FC) technologies, is the fastest growing segment of the electronics packaging and manufacturing market. It is being driven by the increased need for high density interconnects (HDI) for portable communications devices like laptops, cell phones, palm tops and micro-browsers. Packaging is the bottleneck in creating these micro-devices, and area array packaging, creating packages 20 times smaller than those of traditional ...
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Area array packaging, comprising the use of ball grid array (BGA), chip scale package (CSP) and flip chip (FC) technologies, is the fastest growing segment of the electronics packaging and manufacturing market. It is being driven by the increased need for high density interconnects (HDI) for portable communications devices like laptops, cell phones, palm tops and micro-browsers. Packaging is the bottleneck in creating these micro-devices, and area array packaging, creating packages 20 times smaller than those of traditional packaging, is the solution.
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