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Area Array Packaging Processes

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Area Array Packaging Processes - Gilleo, Ken
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This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.

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Area Array Packaging Processes 2003, McGraw-Hill Professional Publishing, New York, NY

ISBN-13: 9780071428293

Hardcover

Area Array Packaging Processes 2003, McGraw-Hill Professional, New York

ISBN-13: 9780071738019

Trade paperback