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Area Array Packaging Processes - Gilleo, Ken
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This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

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Area Array Packaging Processes 2003, McGraw-Hill Professional Publishing, New York, NY

ISBN-13: 9780071428293

Hardcover

Area Array Packaging Processes 2003, McGraw-Hill Professional, New York

ISBN-13: 9780071738019

Trade paperback