Fundamentals of Device and...
Rao Tummala
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Fundamentals of Microsystems...
Rao Tummala
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Semiconductor Advanced...
John H Lau
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Portable Consumer Electronics...
Sridhar Canumalla,
Puligandla Viswanadham
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Thermal Stress and Strain in...
John H Lau (Editor)
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3D IC Stacking Technology
Banqiu Wu,
Ajay Kumar
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Mems and Microsystems: Design...
Tai-Ran Hsu
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3D IC Integration and...
John Lau
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Optoelectronic Packaging
Alan R Mickelson (Editor),
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Integrated Circuit Packaging,...
William Greig
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Chip Scale Package: Design,...
John H Lau,
S W Ricky Lee
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Electronic Packaging,...
Charles A Harper, President,
Martin B Miller (Editor)
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Microelectronics Packaging...
R R Tummala,
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Reliability of Electronic...
Giulio Di Giacomo,
Giulio Di Giacomo
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System on Package:...
Rao Tummala
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Liquid Cooling of Electronic...
Frank P Incropera
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Flip Chip Technologies
John H Lau
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Microelectronics Packaging...
R R Tummala,
Eugene J Rymaszewski
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Antenna-In-Package Technology...
Duixian Liu,
Yueping Zhang
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Microelectronics Packaging...
R R Tummala,
Eugene J Rymaszewski
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Mems Packaging
Yung-cheng Lee (Editor),
Yu-ting Cheng (Editor)
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Advanced MEMS Packaging
John H Lau,
Cheng Kuo Lee
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Microelectronics Packaging...
R R Tummala,
Eugene J Rymaszewski
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Polymer Thick Film: Today's...
Ken Gilleo
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