'Flip Chip' has come to describe a group of related technologies that are used for connecting a chip to a substrate without the use of wires. Instead of using traditional wire leads, the chip is literally placed upside down, lying directly upon the substrate. This is the first book on this topic, a comprehensive reference that covers the design, engineering, and manufacturing of these packages.
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'Flip Chip' has come to describe a group of related technologies that are used for connecting a chip to a substrate without the use of wires. Instead of using traditional wire leads, the chip is literally placed upside down, lying directly upon the substrate. This is the first book on this topic, a comprehensive reference that covers the design, engineering, and manufacturing of these packages.
Read Less
