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6205599899 /
ISBN-13:
9786205599891
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Analyse Du Vide Induit Par La Contrainte Et De L'Électromigration Des Liaisons Cu-Cu
by Harjinder Harjinder
2023, Editions Notre Savoir
ISBN-13:
9786205599891
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GLOUCESTERSHIRE,
UNITED KINGDOM
$44.76
Edition:
2023, Editions Notre Savoir
Paperback,
New
Available Copies: 10+
Details:
ISBN:
6205599899
ISBN-13:
9786205599891
Publisher:
Editions Notre Savoir
Published:
1/19/2023 12: 00: 00 AM
Language:
French
Alibris ID:
17876636948
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Standard Shipping: $4.70
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Seller's Description:
PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK.
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Edition:
2023, Editions Notre Savoir
Paperback,
New
Available Copies: 10+
Details:
ISBN:
6205599899
ISBN-13:
9786205599891
Publisher:
Editions Notre Savoir
Published:
2023
Language:
French
Alibris ID:
17477151714
Shipping Options:
Standard Shipping: $4.70
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
New. Text in French. Trade paperback (US). Glued binding. 56 p.
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