Contamination of Electronic...
Elissa M. Bumiller,
David A. Douthit
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Soldering Processes and...
Michael G Pecht (Editor)
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High-Frequency...
Luc Martens
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High Performance Design...
Jun Dong Cho (Editor),
Paul D Franzon (Editor)
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Lead-Free Soldering in...
Katsuaki Suganuma
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Multilayer Ceramic Substrate ...
K Otsuka
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Materials for high-density...
National Research Council Committee on Materials for High-Density Electronic Packaging
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Materials for Electronic...
Deborah D L Chung
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Electronic Packaging,...
Charles A Harper, President,
Martin B Miller (Editor)
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The Basics of Soldering
Armin Rahn
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Electronic Packaging of High...
Stephen G Konsowski,
Arden R Helland
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Ceramic Interconnect...
Fred D Barlow III (Editor),
Aicha Elshabini (Editor)
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Plastics for Electronics
William M Alvino
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Plastics for Electronics
M Goosey
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Electronic Packaging for High...
R R Tummala (Editor),
Marija Kosec (Editor)
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Characterization of...
Thomas Moore
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Electronics Packaging Forum:...
James E Morris (Editor),
Thomas J Watson (Editor)
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Electronics Packaging Forum:...
James E Morris
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Newnes Electronics Assembly...
Keith Brindley
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Multichip Modules: Systems...
R Wayne Johnson,
Robert Teng (Editor)
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Plastic Packaging of...
Louis Manzione
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Surface Mount and Related...
Ginsberg
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Polymeric Materials for...
John H Lupinski (Editor),
Robert S Moore (Editor)
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Ceramic Substrates and...
Man F. Yan (Editor),
Henry M. O'Bryan (Editor)
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