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Electronics Packaging Forum: Volume Two

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Electronics Packaging Forum: Volume Two - Morris, James E
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Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume ...

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Electronics Packaging Forum: Volume Two 2011, Springer, Dordrecht

ISBN-13: 9789401066815

1991 edition

Trade paperback

Electronics Packaging Forum: Volume Two 1991, Springer, Dordrecht

ISBN-13: 9780442004767

1991 edition

Hardcover