Keep up with the leading-edge technology with this practical volume, which brings a multidisciplinary treatment to the field of electronic packaging and multichip modules. The most comprehensive resource on packaging now, the volume uses real-world examples to focus on the multichip module's important and still emerging role. Important topics covered include building long-term reliability by increasing polyimide stability, recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical ...
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Keep up with the leading-edge technology with this practical volume, which brings a multidisciplinary treatment to the field of electronic packaging and multichip modules. The most comprehensive resource on packaging now, the volume uses real-world examples to focus on the multichip module's important and still emerging role. Important topics covered include building long-term reliability by increasing polyimide stability, recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical processes, circuit and electromagnetic solutions to problems of modeling highspeed electrical interconnections, how to use the finite-difference time-domain approach in electromagnetic modeling, and the development of dedicated test chips for package evaluation in varied field conditions. Electronics Packaging Forum is a key source of information on technology and techniques for businesses involved in packaging today.
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Add this copy of Electronics Packaging Forum: Multichip Module to cart. $17.52, very good condition, Sold by Book Bear rated 5.0 out of 5 stars, ships from West Brookfield, MA, UNITED STATES, published 1994 by IEEE Press.
Edition:
1993, Institute of Electrical & Electronics Engineers(IEEE)
Publisher:
Institute of Electrical & Electronics Engineers(IEEE)
Published:
1994
Language:
English
Alibris ID:
15985667133
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Seller's Description:
Very Good Plus in Printed Boards jacket. 8vo-over 7¾"-9¾" tall. 392 pp. Tightly bound. Corners not bumped. Text is free of markings. No ownership markings.
Add this copy of Electronics Packaging Forum to cart. $30.40, new condition, Sold by Media Smart rated 4.0 out of 5 stars, ships from Hawthorne, CA, UNITED STATES, published 1993 by IEEE Operations Center.
Edition:
1993, Institute of Electrical & Electronics Engineers(IEEE)
Add this copy of Electronics Packaging Forum Multichip Module Technology to cart. $47.16, new condition, Sold by Books International rated 4.0 out of 5 stars, ships from Toronto, ON, CANADA, published 1993 by Institute of Electrical & Electronics Engineers(IEEE).
Edition:
1993, Institute of Electrical & Electronics Engineers(IEEE)
Add this copy of Electronics Packaging Forum: Multichip Module to cart. $48.26, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 1994 by IEEE.
Edition:
1993, Institute of Electrical & Electronics Engineers(IEEE)
Add this copy of Electronics Packaging Forum-Multichip Module Technology to cart. $76.69, new condition, Sold by discount_scientific_books rated 3.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 1993 by Institute of Electrical & Electronics Engineers(IEEE).
Edition:
1993, Institute of Electrical & Electronics Engineers(IEEE)
Add this copy of Electronics Packaging Forum-Multichip Module Technology to cart. $79.64, new condition, Sold by discount_scientific_books rated 3.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 1993 by Institute of Electrical & Electronics Engineers(IEEE).
Edition:
1993, Institute of Electrical & Electronics Engineers(IEEE)
