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Electronic Packaging for High Reliability, Low Cost Electronics

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Electronic Packaging for High Reliability, Low Cost Electronics - Tummala, R R (Editor), and Kosec, Marija (Editor), and Jones, W K (Editor)
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Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and ...

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Electronic Packaging for High Reliability, Low Cost Electronics 2000, Springer, Dordrecht

ISBN-13: 9780792352181

1998 edition

Hardcover