High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High ...
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High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
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Add this copy of High-Frequency Characterization of Electronic Packaging to cart. $112.32, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2014 by Springer-Verlag New York Inc..
Add this copy of High-Frequency Characterization of Electronic Packaging to cart. $51.88, fair condition, Sold by Goodwill of the Olympics rated 5.0 out of 5 stars, ships from TACOMA, WA, UNITED STATES, published 1998 by Springer.
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Fair. An acceptable and readable copy. All pages are intact, and the spine and cover are also intact. This item may have light highlighting, writing or underlining through out the book, curled corners, missing dust jacket and or stickers.
Add this copy of High-Frequency Characterization of Electronic Packaging to cart. $54.25, very good condition, Sold by Crossroad Books rated 5.0 out of 5 stars, ships from Eau Claire, WI, UNITED STATES, published 1998 by Kluwer Academic Publishers.
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Very Good+ with no dust jacket. Just a bit of very light surface rubbing. Else binding clean & bright. Previous owners inscription on the front flyleaf. Else pages clean.; 25A; 9.6 X 6.3 X 0.7 inches; 158 pages.
Add this copy of High-Frequency Characterization of Electronic Packaging to cart. $93.72, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 1998 by Springer.
Add this copy of High-Frequency Characterization of Electronic Packaging to cart. $112.32, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 1998 by Springer.
Add this copy of High-Frequency Characterization of Electronic Packaging to cart. $130.39, new condition, Sold by GridFreed rated 4.0 out of 5 stars, ships from North Las Vegas, NV, UNITED STATES, published 1998 by Springer.
Add this copy of High-Frequency Characterization of Electronic Packaging to cart. $188.09, new condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 1998 by Springer.
