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The Electronic Packaging...
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High Temperature Electronics
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Lead-free Soldering Process...
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Hermeticity of electronic...
Hal Greenhouse
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Advanced Materials for...
Xingcun Colin Tong
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James J Licari,
Dale W Swanson
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Advanced Wirebond...
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Electrical Conductive...
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Reflow Soldering Processes
Ning-Cheng Lee
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Thermal and Structural...
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Jeremiah Gayle
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Run-To-Run Control in...
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Modeling and Design of...
Xing-Chang Wei
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Mechanical Analysis of...
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Air cooling technology for...
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Electronic Packaging...
Michael Pecht,
Rakish Agarwal
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Contamination of Electronic...
Elissa M. Bumiller,
David A. Douthit
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High Performance Design...
Jun Dong Cho (Editor),
Paul D Franzon (Editor)
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Ceramic Interconnect...
Fred D Barlow III (Editor),
Aicha Elshabini (Editor)
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Materials for Electronic...
Deborah D L Chung
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Plastics for Electronics
M Goosey
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Characterization of...
Thomas Moore
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Newnes electronics assembly...
Keith Brindley
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Newnes Electronics Assembly...
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