Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. Read More

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. Read Less

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  	This is a digital edition of this title. Rent eBook (2 Options) 180 Day Rental: $34.10 (Expires Jun 25, 2025) 365 Day Rental: $40.30 (Expires Dec 27, 2025) Buy eBook Lifetime Access: $61.99 Title: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments by Juan Cepeda-Rizo; Jeremiah Gayle; Joshua Ravich Publisher: Taylor & Francis Print ISBN: 9781032160856, 1032160853 eText ISBN: 9781000511086 Edition: 2024 1st edition Format: EPUB eBook	$34.10 Rent eBook This is a digital eBook Nothing will be shipped to you Works with web browsers and the VitalSource app on all Windows, Mac, Chromebook, Kindle Fire, iOS, and Android devices Most eBooks are returnable within 14 days of purchase Questions? See our eBook FAQ