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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Cepeda-Rizo, Juan, and Gayle, Jeremiah, and Ravich, Joshua
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This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments 2021, CRC Press, Oxford

ISBN-13: 9781032160818

Hardcover