Mems Packaging
Yung-cheng Lee (Editor),
Yu-ting Cheng (Editor)
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Advanced MEMS Packaging
John H Lau,
Cheng Kuo Lee
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Microelectronics Packaging...
R R Tummala,
Eugene J Rymaszewski
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Polymer Thick Film: Today's...
Ken Gilleo
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RF Measurements of Die and...
Scott A Wartenberg
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Modeling and Simulation for...
Shen Liu,
Yong Liu
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Mems/Moem Packaging: Concepts...
Ken Gilleo
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IC Component Sockets
Weifeng Liu,
Michael G Pecht
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Mems: Fundamental Technology...
Vikas Choudhary (Editor),
Krzysztof Iniewski (Editor)
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Area Array Packaging Handbook...
Ken Gilleo,
Gilleo Ken
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Advanced Electronic Packaging...
William D Brown (Editor)
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Semiconductor Packaging:...
Andrea Chen,
Randy Hsiao-Yu Lo
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Quantum-Well Laser Array...
Jens W Tomm,
Juan Jiménez
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Multichip Module Technologies...
Daryl Ann Doane,
Paul Franzon
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Microelectronic Packaging
M Datta (Editor),
Tetsuya Osaka (Editor)
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Electronic Packaging and...
Morris E Nicholson
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Introduction to Microsystem...
Yufeng Jin,
Zhiping Wang
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Foldable Flex and Thinned...
John W Balde (Editor)
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Adhesion in Microelectronics
K L Mittal,
Tanweer Ahsan
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Area Array Packaging Processes
Ken Gilleo
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Directions for the Next...
Nirod K Das (Editor),
Henry L Bertoni (Editor)
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Microelectronics Technology:...
Elsa Reichmanis (Editor),
Christopher K Ober (Editor)
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Multichip Modules: Systems...
R Wayne Johnson,
Robert Teng (Editor)
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Microelectronic System...
Stuart K Tewksbury,
Stuart K Tewskbury (Editor)
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