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ISBN: 9783319096469
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331909646X /
ISBN-13:
9783319096469
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Thermal Transport in Oblique Finned Micro/Minichannels
by Fan, Yan, and Lee, Poh Seng, and Singh, Pawan Kumar
2014, Springer
ISBN-13:
9783319096469
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Add this copy of Thermal Transport in Oblique Finned Micro/Minichannels to cart. $60.65, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2014 by Springer.
Edition: 2014, Springer
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Details: ISBN:
331909646X
ISBN-13:
9783319096469
Edition:
2015 edition
Publisher:
Springer
Published:
2014
Language:
English
Alibris ID:
12531217569
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Seller's Description: New. Print on demand Trade paperback (US). Glued binding. 130 p. Contains: Illustrations, black & white, Illustrations, color.
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Thermal Transport in Oblique Finned Micro/Minichannels (Springerbriefs in Applied Sciences and Technology)
by Fan, Yan
2014, Springer
ISBN-13:
9783319096469
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$87.09
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Add this copy of Thermal Transport in Oblique Finned Micro/Minichannels to cart. $87.09, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2014 by Springer.
Edition: 2014, Springer
Paperback,
Good
Details: ISBN:
331909646X
ISBN-13:
9783319096469
Edition:
2015 edition
Publisher:
Springer
Published:
2014
Language:
English
Alibris ID:
17984905167
Shipping Options: Standard Shipping: $4.57
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Seller's Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book.
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