Additive and Advanced Manufacturing, Inverse Problem Methodologies and Machine Learning and Data Science, Volume 4: Proceedings of the 2023 Annual Conference & Exposition on Experimental and Applied Mechanics
Additive and Advanced Manufacturing, Inverse Problem Methodologies and Machine Learning and Data Science, Volume 4 of the Proceedings of the 2023 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the fourth volume of five from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of topics and includes papers in the following general technical research areas: AM Composites and Polymers ...
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Additive and Advanced Manufacturing, Inverse Problem Methodologies and Machine Learning and Data Science, Volume 4 of the Proceedings of the 2023 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the fourth volume of five from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of topics and includes papers in the following general technical research areas: AM Composites and Polymers Dynamic Behavior of Additively Manufactured Materials and Structures Joint Residual Stress and Additive Manufacturing ML for Material Model Identification Novel AM Structures Novel Processing and Testing of Additively Manufactured Materials Plasticity and Complex Material Behavior Virtual Fields Method
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Add this copy of Additive and Advanced Manufacturing, Inverse Problem to cart. $243.84, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2024 by Springer International Publishing AG.
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New. Contains: Illustrations, black & white, Illustrations, color. Conference Proceedings of the Society for Experimental Mechanics Series . VII, 102 p. 86 illus., 73 illus. in color. Intended for professional and scholarly audience.