Add this copy of Characterization of Integrated Circuit Packaging to cart. $57.04, very good condition, Sold by Hay-on-Wye Booksellers rated 4.0 out of 5 stars, ships from Hereford, UNITED KINGDOM, published 2010 by Momentum Press.
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Seller's Description:
Very Good. Some shelfwear to the extremities in places. Content is clean throughout. Sewn binding. Cloth over boards. 274 p. Contains: Tables, black & white, Figures. Materials Characterization.
Add this copy of Characterization of Integrated Circuit Packaging to cart. $15.00, good condition, Sold by Bookmans rated 5.0 out of 5 stars, ships from Tucson, AZ, UNITED STATES, published 2010 by Momentum Press.
Add this copy of Characterization of Integrated Circuit Packaging to cart. $46.46, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2010 by Momentum Press.
Add this copy of Characterization of Integrated Circuit Packaging to cart. $78.60, new condition, Sold by discount_scientific_books rated 4.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2010 by Momentum Press.
Add this copy of Characterization of Integrated Circuit Packaging to cart. $88.03, fair condition, Sold by Books International rated 3.0 out of 5 stars, ships from Toronto, ON, CANADA, published 2010 by Momentum Press.
