"Tools alone aren't enough to reduce dynamic and leakage power in complex chip designs - a well-planned methodology is needed. Following in the footsteps of the successful Reuse Methodology Manual (RMM), authors from ARM and Synopsys have written this Low Power Methodology Manual (LPMM) to describe [such] [a] low-power methodology with a practical, step-by-step approach." Richard Goering, Software Editor, EE Times "Excellent compendium of low-power techniques and guidelines with balanced content spanning theory and ...
Read More
"Tools alone aren't enough to reduce dynamic and leakage power in complex chip designs - a well-planned methodology is needed. Following in the footsteps of the successful Reuse Methodology Manual (RMM), authors from ARM and Synopsys have written this Low Power Methodology Manual (LPMM) to describe [such] [a] low-power methodology with a practical, step-by-step approach." Richard Goering, Software Editor, EE Times "Excellent compendium of low-power techniques and guidelines with balanced content spanning theory and practical implementation. The LPMM is a very welcome addition to the field of low power SoC implementation that has for many years operated in a largely ad-hoc fashion." Sujeeth Joseph, Chief Architect - Semiconductor and Systems Solutions Unit, Wipro Technologies "The LPMM enables broader adoption of aggressive power management techniques based on extensive experience and silicon example with real data that every SOC designer can use to meet the difficulties faced in managing the power issues in deep submicron designs." Anil Mankar, Sr VP Worldwide Core Engineering and Chief Development Officer, Conexant Systems Inc. "Managing power, at 90nm and below, introduces significant challenges to design flow. The LPMM is a timely and immediately useful book that shows how combination of tools, IP and methodology can be used together to address power management." Nick Salter, Head of Chip Integration, CSR plc.
Read Less
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Fine. Sewn binding. Paper over boards. 300 p. Contains: Unspecified. Integrated Circuits and Systems. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
New. Sewn binding. Paper over boards. 300 p. Contains: Unspecified. Integrated Circuits and Systems. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can included some highlighting and writing page and cover creases as well as other types visible wear.