In these proceedings from the workshop held in September 2005, contributors describe their work on stress-induced phenomena in on-chip metal interconnects and solder joints. General topics include the physical properties and reliability of metal interconnects and barriers, mechanical properties and reliability of low-k and ultra low-k materials, th
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In these proceedings from the workshop held in September 2005, contributors describe their work on stress-induced phenomena in on-chip metal interconnects and solder joints. General topics include the physical properties and reliability of metal interconnects and barriers, mechanical properties and reliability of low-k and ultra low-k materials, th
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Add this copy of Stress-Induced Phenomena in Metallization: Eighth to cart. $134.45, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2006 by American Institute of Physics.
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