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Advanced Interconnects for ULSI Technology - Baklanov, Mikhail (Editor), and Ho, Paul S. (Editor), and Zschech, Ehrenfried (Editor)
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Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable ...

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Advanced Interconnects for ULSI Technology 2012, John Wiley & Sons Inc, New York

ISBN-13: 9780470662540

Hardcover