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MCM C/Mixed Technologies and Thick Film Sensors - Jones, W K (Editor), and Kurzweil, Karel (Editor), and Harsányi, Gábor (Editor)
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Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low ...

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MCM C/Mixed Technologies and Thick Film Sensors 2012, Springer, Dordrecht

ISBN-13: 9789401040396

Trade paperback

MCM C/Mixed Technologies and Thick Film Sensors 1995, Springer, Dordrecht

ISBN-13: 9780792334606

1995 edition

Hardcover