This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
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This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
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Condition: Reverse
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Pub Date: Reverse
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Edition: 2003, McGraw-Hill Professional Publishing
Hardcover,
New
Details: ISBN:
0071428275
ISBN-13:
9780071428279
Pages:
204
Publisher:
McGraw-Hill Professional Publishing
Published:
2003
Language:
English
Alibris ID:
18180717910
Shipping Options: Standard Shipping: $4.63
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Seller's Description: Brand New. New Book Original US edition, We Ship to PO BOX Address also.
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Edition: 2003, McGraw-Hill Professional Publishing
Hardcover,
Good
Details: ISBN:
0071428275
ISBN-13:
9780071428279
Pages:
204
Publisher:
McGraw-Hill Professional Publishing
Published:
2003
Language:
English
Alibris ID:
18029015539
Shipping Options: Standard Shipping: $4.63
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book.
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Edition: 2003, McGraw-Hill Professional Publishing
Hardcover,
Good
Available Copies: 4
Details: ISBN:
0071428275
ISBN-13:
9780071428279
Pages:
204
Publisher:
McGraw-Hill Professional Publishing
Published:
2003
Language:
English
Alibris ID:
18177304383
Shipping Options: Standard Shipping: $4.63
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description: Good.
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ISBN-13: 9780071428279
Hardcover
