Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
Add this copy of Thermal and Structural Electronic Packaging Analysis to cart. $103.32, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2024 by CRC Press.
