- Books
- ISBN: 9780070326194
Edition
ISBN: 0070326193 /
ISBN-13: 9780070326194
- Book Details
- Seller
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- Edition:
- 1997, McGraw-Hill Professional Publishing
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Hardcover,
Very Good
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- Details:
- ISBN:
0070326193
- ISBN-13:
9780070326194
- Edition:
2nd Revised edition
- Publisher:
McGraw-Hill Professional Publishing
- Published:
1997
- Language:
English
- Alibris ID:
18124400529
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- Seller's Description:
- Very good. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
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Hardcover,
Good
Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield (McGraw-Hill Electronic Packaging and Interconnection Series)
by Harman, George
1997, McGraw-Hill Education
ISBN-13:
9780070326194
See Item Details ▾
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Bonita
HIGH
Newport Coast,
CA,
USA
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$132.78
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|
- Edition:
- 1997, McGraw-Hill Education
-
Hardcover,
Good
|
- Details:
- ISBN:
0070326193
- ISBN-13:
9780070326194
- Edition:
2nd Revised edition
- Publisher:
McGraw-Hill Education
- Published:
1997
- Language:
English
- Alibris ID:
18117728558
|
- Shipping Options:
- Standard Shipping: $4.72
Choose your shipping method in Checkout. Costs may vary based on destination.
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- Seller's Description:
- Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book.
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