Wolfgang Borutzky
Wolfgang Borutzky is a professor for Modelling and Simulation of Engineering Systems retired from Bonn-Rhein-Sieg University of Applied Sciences, Germany. He obtained his University Diploma Degree in Mathematics and his Doctoral Degree in Mechanical Engineering both from the Technical University of Braunschweig, Germany. He held an honorary position as Associate Professor of Electrical Engineering and Information Technology at the University of Dubrovnik, Croatia. Dr. Borutzky has published in...See more
Wolfgang Borutzky is a professor for Modelling and Simulation of Engineering Systems retired from Bonn-Rhein-Sieg University of Applied Sciences, Germany. He obtained his University Diploma Degree in Mathematics and his Doctoral Degree in Mechanical Engineering both from the Technical University of Braunschweig, Germany. He held an honorary position as Associate Professor of Electrical Engineering and Information Technology at the University of Dubrovnik, Croatia. Dr. Borutzky has published in the proceedings of many peer-reviewed international conferences on Modelling and Simulation and in refereed scientific journals. In 2019 he received the best paper award of the 12th International Conference on Integrated Modelling and Analysis in Applied Control and Automation (IMAACA 2019) in Lisbon, Portugal, which is part of the annual International Multidisciplinary Modelling & Simulation Multiconference (I3M). He is the author of a 2010 Springer monograph on Bond Graph Methodology, of a 2015 Springer book on Bond Graph model-based fault diagnosis in hybrid systems and a 2020 Springer book titled Bond Graph Modelling for Control, Fault Diagnosis and Failure Prognosis. He is also the editor and a co-author of a 2011 Springer compilation text on Bond Graph Modelling of Engineering Systems and of a 2016 Springer compilation text entitled Bond Graphs for Modelling, Control and Fault Diagnosis with contributions from experts in various fields from all over the world. Furthermore, he was the guest editor of two special journal issues on bond graph modelling. See less
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