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1. Interconnect Reliability in Advanced Memory Device Packaging
by Chong Leong Gan, Gan, Chen-Yu Huang, Huang
Seller Description: PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
2023, Springer Nature B. V
ISBN-13: 9783031267093
Softcover, New
Fairford, GLOUCESTERSHIRE, UNITED KINGDOM
$51.86
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2. Interconnect Reliability in Advanced Memory Device Packaging
by Chong Leong Gan, Gan, Chen-Yu Huang, Huang
Seller Description: PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
2023, Springer Nature B. V
ISBN-13: 9783031267093
Softcover, New
Fairford, GLOS, UNITED KINGDOM
$55.04
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3. Interconnect Reliability in Advanced Memory Device Packaging
by Gan, Chong Leong,, and Huang, Chen-Yu,
Seller Description: New. Contains: Illustrations, black & white, Illustrations, color. Springer Series in Reliability Engineering . XVIII, 210 p. 100 illus., 89 illus. in color. Intended for professional and scholarly audience. See More Details
2023, Springer International Publishing AG
ISBN-13: 9783031267079
Hardcover, New
NV, USA
$215.66