Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. This is a reference on wire bonding. It emphasis on fine pitch bonding, bonding to MCMs, and additional areas.
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Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. This is a reference on wire bonding. It emphasis on fine pitch bonding, bonding to MCMs, and additional areas.
Read Less
