Designing VLSI systems represents a challenging task. It is a transfonnation among different specifications corresponding to different levels of design: abstraction, behavioral, stntctural and physical. The behavioral level describes the functionality of the design. It consists of two components; static and dynamic. The static component describes operations, whereas the dynamic component describes sequencing and timing. The structural level contains infonnation about components, control and connectivity. The physical level ...
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Designing VLSI systems represents a challenging task. It is a transfonnation among different specifications corresponding to different levels of design: abstraction, behavioral, stntctural and physical. The behavioral level describes the functionality of the design. It consists of two components; static and dynamic. The static component describes operations, whereas the dynamic component describes sequencing and timing. The structural level contains infonnation about components, control and connectivity. The physical level describes the constraints that should be imposed on the floor plan, the placement of components, and the geometry of the design. Constraints of area, speed and power are also applied at this level. To implement such multilevel transfonnation, a design methodology should be devised, taking into consideration the constraints, limitations and properties of each level. The mapping process between any of these domains is non-isomorphic. A single behavioral component may be transfonned into more than one structural component. Design methodologies are the most recent evolution in the design automation era, which started off with the introduction and subsequent usage of module generation especially for regular structures such as PLA's and memories. A design methodology should offer an integrated design system rather than a set of separate unrelated routines and tools. A general outline of a desired integrated design system is as follows: * Decide on a certain unified framework for all design levels. * Derive a design method based on this framework. * Create a design environment to implement this design method.
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Fine. Trade paperback (US). Glued binding. 399 p. The Springer International Engineering and Computer Science, 257. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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Fine. Trade paperback (US). Glued binding. 399 p. The Springer International Engineering and Computer Science, 257. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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0792394283. Hardcover; no dustjacket. This is an Ex-Corporate-Library copy, with all the typical markings (from a Cray Research technical library). Fair condition only. A bit of light surface rubbing to the boards. Library labels on the front board and spine tail. The spine background color has sunned to blue; but the lettering appears unaffected. Else binding clean. There are dampstains at the top corners of the endpapers, and the pages are somewhat wavy at the top corner-have been damp at one time. All the text is fully readable, and there is no odor. There is a pocket on the rear pastedown, and Cray inkstamps on the flyleaves; with no additional library markings. A useable working copy of an otherwise pricey volume.; 29A; 9-1/4" x 6-1/4"; 399 pages.
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Fine. Sewn binding. Cloth over boards. 399 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 257. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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Fine. Sewn binding. Cloth over boards. 399 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 257. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
