Skip to main content alibris logo

Tsv 3D RF Integration: High Resistivity Si Interposer Technology

by ,

Write The First Customer Review
Tsv 3D RF Integration: High Resistivity Si Interposer Technology - Ma, Shenglin, and Jin, Yufeng
Filter Results
Item Condition
Seller Rating
Other Options
Change Currency
Browse related Subjects
+ Browse All Subjects

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the ...

loading
Tsv 3D RF Integration: High Resistivity Si Interposer Technology 2022, Elsevier

ISBN-13: 9780323996020

Trade paperback