A large international conference, Intelligent Systems and Computer Engineering, was held in Hong Kong, March 21-23, 2007, under the International MultiConf- ence of Engineers and Computer Scientists (IMECS) 2007. The IMECS 2007 is organized by the International Association of Engineers (IAENG), a nonpro?t int- national association for engineers and computer scientists. The IMECS conferences serve as good platforms for the engineering community to meet with each other and to exchange ideas. The conferences also strike a ...
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A large international conference, Intelligent Systems and Computer Engineering, was held in Hong Kong, March 21-23, 2007, under the International MultiConf- ence of Engineers and Computer Scientists (IMECS) 2007. The IMECS 2007 is organized by the International Association of Engineers (IAENG), a nonpro?t int- national association for engineers and computer scientists. The IMECS conferences serve as good platforms for the engineering community to meet with each other and to exchange ideas. The conferences also strike a balance between theoretical and - plication development. The conference committees have been formed with over two hundred committee members who are mainly research center heads, faculty deans, department heads, professors, and research scientists from over thirty countries. The conferences are truly international meetings with a high level of participation from many countries. The response that we have received for the multiconference is - cellent. There have been more than one thousand one hundred manuscript subm- sions for the IMECS 2007. All submitted papers have gone through the peer review process and the overall acceptance rate is 58. 46%. This volume contains revised and extended research articles on intelligent s- tems and computer engineering written by prominent researchers participating in the multiconference IMECS 2007. There is huge demand, not only for theories but also applications, for the intelligent systems and computer engineering inthe society to meet the needs of rapidly developing top-end high technologies and to improve the increasing high quality of life.
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Fine. Trade paperback (US). Glued binding. 670 p. Contains: Unspecified. Lecture Notes in Electrical Engineering, 6. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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New. Trade paperback (US). Glued binding. 670 p. Contains: Unspecified. Lecture Notes in Electrical Engineering, 6. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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Fine. Trade paperback (US). Glued binding. 670 p. Contains: Unspecified. Lecture Notes in Electrical Engineering, 6. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Choose your shipping method in Checkout. Costs may vary based on destination.
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New. Trade paperback (US). Glued binding. 670 p. Contains: Unspecified. Lecture Notes in Electrical Engineering, 6. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
