Tiny metal structures, less than a millionth of a metre across, are critical building blocks in a number of high-tech devices such as computer chips. These metallizations are subjected to extreme conditions of temperature, electric current density and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.
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Tiny metal structures, less than a millionth of a metre across, are critical building blocks in a number of high-tech devices such as computer chips. These metallizations are subjected to extreme conditions of temperature, electric current density and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.
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Add this copy of Stress Induced Phenomena in Metallization: Sixth to cart. $40.53, new condition, Sold by SellingTales rated 5.0 out of 5 stars, ships from Belvidere, NJ, UNITED STATES, published 2002 by American Institute of Physics.
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