This monograph represents a summary of our work in the last two years in applying the method of simulated annealing to the solution of problems that arise in the physical design of VLSI circuits. Our study is experimental in nature, in that we are con- cerned with issues such as solution representations, neighborhood structures, cost functions, approximation schemes, and so on, in order to obtain good design results in a reasonable amount of com- putation time. We hope that our experiences with the techniques we employed, ...
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This monograph represents a summary of our work in the last two years in applying the method of simulated annealing to the solution of problems that arise in the physical design of VLSI circuits. Our study is experimental in nature, in that we are con- cerned with issues such as solution representations, neighborhood structures, cost functions, approximation schemes, and so on, in order to obtain good design results in a reasonable amount of com- putation time. We hope that our experiences with the techniques we employed, some of which indeed bear certain similarities for different problems, could be useful as hints and guides for other researchers in applying the method to the solution of other prob- lems. Work reported in this monograph was partially supported by the National Science Foundation under grant MIP 87-03273, by the Semiconductor Research Corporation under contract 87-DP- 109, by a grant from the General Electric Company, and by a grant from the Sandia Laboratories.
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New. Print on demand Trade paperback (US). Glued binding. 202 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 42.
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Fine. Trade paperback (US). Glued binding. 202 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 42. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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New. Trade paperback (US). Glued binding. 202 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 42. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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Fine. Trade paperback (US). Glued binding. 202 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 42. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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New. Trade paperback (US). Glued binding. 202 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 42. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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Very good. No dust jacket. Sewn binding. Cloth over boards. 202 p. The Springer International Engineering and Computer Science, 42. Audience: General/trade. Near fine copy. Only mark on the book is a price written on first flyleaf. Very nice copy.
