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Semiconductor Packaging: Materials Interaction and Reliability

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Semiconductor Packaging: Materials Interaction and Reliability - Chen, Andrea, and Lo, Randy Hsiao-Yu
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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing-package assembly and testing. It covers the basics of material properties and explains how to determine which ...

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Semiconductor Packaging: Materials Interaction and Reliability 2017, CRC Press, London

ISBN-13: 9781138075405

Paperback

Semiconductor Packaging: Materials Interaction and Reliability 2011, CRC Press, Oxford

ISBN-13: 9781439862056

Hardcover