Recent Global Research and Education: Technological Challenges: Proceedings of the 15th International Conference on Global Research and Education Inter-Academia 2016
Recent Global Research and Education: Technological Challenges: Proceedings of the 15th International Conference on Global Research and Education Inter-Academia 2016
Developments in the connected fields of solid state physics, bioengineering, mechatronics and nanometrology have had a profound effect on the emergence of modern technologies and their influence on our lives. In all of these fields, understanding and improving the basic underlying materials is of crucial importance for the development of systems and applications. The International Conference Inter-Academia 2016 has successfully married these fields and become a regular feature in the conference calendar. It consisted ...
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Developments in the connected fields of solid state physics, bioengineering, mechatronics and nanometrology have had a profound effect on the emergence of modern technologies and their influence on our lives. In all of these fields, understanding and improving the basic underlying materials is of crucial importance for the development of systems and applications. The International Conference Inter-Academia 2016 has successfully married these fields and become a regular feature in the conference calendar. It consisted of seven thematic areas in the field of material science, nanotechnology, biotechnology, plasma physics, metrology, robotics, sensors and devices. The book Recent Global Research and Education: Technological Challenges is intended for use in academic, government and industry R&D departments, as an indispensable reference tool for the years to come. Also, we hope that the volume can serve the world community as the definitive reference source in Advances in Intelligent Systems and Computing. This book comprises carefully selected 68 contributions presented at the 15 th International Conference on Global Research and Education INTER-ACADEMIA 2016, organized by Faculty of Mechatronics, Warsaw University of Technology, on September 26-28, in Warsaw, Poland. It is the second volume in series, following the edition in 2015. It brings together the knowledge and experience of 150 leading researchers representing 13 countries. We would like to thank all contributors and reviewers for helping us to put-together this book.
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New. Print on demand Trade paperback (US). Glued binding. 518 p. Contains: Unspecified, Illustrations, black & white. Advances in Intelligent Systems and Computing, 519.
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Fine. Trade paperback (US). Glued binding. 518 p. Contains: Unspecified, Illustrations, black & white. Advances in Intelligent Systems and Computing, 519. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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New. Trade paperback (US). Glued binding. 518 p. Contains: Unspecified, Illustrations, black & white. Advances in Intelligent Systems and Computing, 519. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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Seller's Description:
New. Trade paperback (US). Glued binding. 518 p. Contains: Unspecified, Illustrations, black & white. Advances in Intelligent Systems and Computing, 519. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Fine. Trade paperback (US). Glued binding. 518 p. Contains: Unspecified, Illustrations, black & white. Advances in Intelligent Systems and Computing, 519. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.