This book discusses the practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). Assembly, packaging and testing of MEMS and mircrosystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered.
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This book discusses the practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). Assembly, packaging and testing of MEMS and mircrosystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered.
Read Less
Add this copy of Mems Packaging (Materials, Circuits and Devices) to cart. $36.98, fair condition, Sold by HPB-Red rated 5.0 out of 5 stars, ships from Dallas, TX, UNITED STATES, published 2003 by The Institution of Engineering a.
Publisher:
Institution of Engineering & Technology
Published:
2003
Language:
English
Alibris ID:
18071270802
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Seller's Description:
Fair. Connecting readers with great books since 1972. Used textbooks may not include companion materials such as access codes, etc. May have condition issues including wear and notes/highlighting. We ship orders daily and Customer Service is our top priority!
Add this copy of Mems Packaging (Materials, Circuits and Devices) to cart. $36.98, fair condition, Sold by Goodwill of Orange County rated 4.0 out of 5 stars, ships from Santa Ana, CA, UNITED STATES, published 2003 by Institution of Engineering & Technology.
Publisher:
Institution of Engineering & Technology
Published:
2003
Language:
English
Alibris ID:
17751223954
Shipping Options:
Standard Shipping: $4.58
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Fair. This is a USED book, it is subject to external and interior wear including, underlining, highlighting, annotations, water damage, minor scuffs and tears. This is a donated book accepted as is. Stickers and sticker residue on the cover should be expected, as well as spine wear from use. There are NO codes or disc(s) included. All items ship Monday-Friday within 2-3 business days. Thank you for supporting Goodwill of OC.
Add this copy of Mems Packaging to cart. $56.91, good condition, Sold by Anybook rated 5.0 out of 5 stars, ships from Lincoln, UNITED KINGDOM, published 2004 by Institution Of Engineering And Technology.
Publisher:
Institution of Engineering & Technology
Published:
2004
Language:
English
Alibris ID:
18188050237
Shipping Options:
Standard Shipping: $4.58
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
This is an ex-library book and may have the usual library/used-book markings inside. This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item, 800grams, ISBN: 9780863413353.
Add this copy of Mems Packaging to cart. $68.48, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2003 by Institution of Engineering & Technology.
Add this copy of Mems Packaging (Materials, Circuits and Devices) to cart. $74.79, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2003 by The Institution of Engineering.
