Add this copy of Materials and Processes for Microwave Hybrids to cart. $12.13, very good condition, Sold by ThriftBooks-Reno rated 5.0 out of 5 stars, ships from Reno, NV, UNITED STATES, published 1991 by International Society for Hybrid Microelectronics.
Edition:
1991, International Society for Hybrid Microelectronics
Add this copy of Materials and Processes for Microwave Hybrids to cart. $12.13, good condition, Sold by ThriftBooks-Dallas rated 5.0 out of 5 stars, ships from Dallas, TX, UNITED STATES, published 1991 by International Society for Hybrid Microelectronics.
Edition:
1991, International Society for Hybrid Microelectronics
Add this copy of Materials and Processes for Microwave Hybrids to cart. $12.14, good condition, Sold by HPB-Red rated 5.0 out of 5 stars, ships from Dallas, TX, UNITED STATES, published 1991 by International Society for Hybrid.
Edition:
1991, International Society for Hybrid Microelectronics
Publisher:
International Society for Hybrid Microelectronics
Published:
1991
Language:
English
Alibris ID:
18073810560
Shipping Options:
Standard Shipping: $4.48
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Add this copy of Materials and Processes for Microwave Hybrids to cart. $12.15, good condition, Sold by HPB-Red rated 5.0 out of 5 stars, ships from Dallas, TX, UNITED STATES, published 1991 by International Society for Hybrid.
Edition:
1991, International Society for Hybrid Microelectronics
Publisher:
International Society for Hybrid Microelectronics
Published:
1991
Language:
English
Alibris ID:
18080556976
Shipping Options:
Standard Shipping: $4.48
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Add this copy of Materials and Processes for Microwave Hybrids to cart. $69.00, very good condition, Sold by BingoBooks2 rated 5.0 out of 5 stars, ships from Vancouver, WA, UNITED STATES, published 1991 by international society for hybrid microelectronics.
Edition:
1991, International Society for Hybrid Microelectronics
Add this copy of Materials and Processes for Microwave Hybrids to cart. $12.14, very good condition, Sold by Book Alley rated 4.0 out of 5 stars, ships from Pasadena, CA, UNITED STATES, published 1991 by International Society for Hybrid.
Edition:
1991, International Society for Hybrid Microelectronics
Add this copy of Materials and Processes for Microwave Hybrids to cart. $12.14, good condition, Sold by Bookmans rated 4.0 out of 5 stars, ships from Tucson, AZ, UNITED STATES, published 1991 by International Society for Hybrid.
Edition:
1991, International Society for Hybrid Microelectronics
Add this copy of Materials and Processes for Microwave Hybrids to cart. $30.74, very good condition, Sold by HPB Inc. rated 4.0 out of 5 stars, ships from Dallas, TX, UNITED STATES, published 1991 by International Society for Hybrid.
Edition:
1991, International Society for Hybrid Microelectronics
Publisher:
International Society for Hybrid Microelectronics
Published:
1991
Language:
English
Alibris ID:
18092869739
Shipping Options:
Standard Shipping: $4.48
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Very good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority!
Add this copy of Materials and Processes for Microwave Hybrids to cart. $41.13, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 1991 by International Society for Hybr.
Edition:
1991, International Society for Hybrid Microelectronics
Add this copy of Materials and Processes for Microwave Hybrids to cart. $132.00, good condition, Sold by Ground Zero Books, Ltd. rated 3.0 out of 5 stars, ships from Silver Spring, MD, UNITED STATES, published 1991 by International Society For Hybrid Microelectronics.
Edition:
1991, International Society for Hybrid Microelectronics
Edition:
Presumed First Edition, First printing thus
Publisher:
International Society for Hybrid Microelectronics
Published:
1991
Language:
English
Alibris ID:
17971723034
Shipping Options:
Standard Shipping: $4.48
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Good. x, 294 pages. Figures. Formulae. Tables. References. Index. Name of previous owner in ink on fore-edge. Inscribed sentiment by the author on the fep. Sentiment reads With the author's compliments. Some spine sunning noted. Richard Brown 2/10/94. No dust jacket present. This is a Technical Monograph for the International Society for Hybrid Microelectronics. In 1991 this author published a monograph based on his experience teaching microwave hybrid materials and processing technology at the annual ISHM (now the International Microelectronics and Packaging Society, IMAPS) symposia. Since that time, the course has been presented at that venue and on-site at a number of industrial and government organizations. The course has been continually revised to reflect the many evolutionary changes in materials and processes. Microwave technology has existed for almost 175 years. It was only after the invention of the klystron, just before World War II, that microwave design and manufacture moved from a few visionaries to the growth the industry sees today. Over the last decade alone there have been exploding applications for all types of high frequency electronics in the military, automotive, wireless, computer, telecommunications and medical industries. These have placed demands, unimaginable a decade ago, on designs, materials, processes and equipment to meet the ever expanding requirements for increasingly reliable, smaller, faster and lower cost circuits. A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534. Hybrid circuits could be encapsulated in epoxy or in military and space applications, a lid was soldered onto the package. A hybrid circuit serves as a component on a PCB in the same way as a monolithic integrated circuit; the difference between the two types of devices is in how they are constructed and manufactured. The advantage of hybrid circuits is that components which cannot be included in a monolithic IC can be used, e.g., capacitors of large value, wound components, crystals, inductors. In military and space applications, numerous integrated circuits, transistors and diodes, in their die form, would be placed on either a ceramic or beryllium substrate. Either gold or aluminum wire would be bonded from the pads of the IC, transistor, or diode to the substrate. Thick film technology is often used as the interconnecting medium for hybrid integrated circuits. The use of screen printed thick film interconnect provides advantages of versatility over thin film although feature sizes may be larger and deposited resistors wider in tolerance. Multi-layer thick film is a technique for further improvements in integration using a screen printed insulating dielectric to ensure connections between layers are made only where required. One key advantage for the circuit designer is complete freedom in the choice of resistor value in thick film technology. Planar resistors are also screen printed and included in the thick film interconnect design. The composition and dimensions of resistors can be selected to provide the desired values. The final resistor value is determined by design and can be adjusted by laser trimming. Once the hybrid circuit is fully populated with components, fine tuning prior to final test may be achieved by active laser trimming. Thin film technology was also employed in the 1960s. Ultra Electronics manufactured circuits using a silica glass substrate. A film of tantalum was deposited by sputtering followed by a layer of gold by...
