Now updated, this handbook addresses wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. It discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, and residue from wafer surfaces.
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Now updated, this handbook addresses wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. It discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, and residue from wafer surfaces.
Read Less
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Seller's Description:
Fair. This item is in overall acceptable condition. Covers are intact but may have heavy wear including creases, bends, edge wear, curled corners or minor tears as well as stickers or sticker-residue. Pages are intact but may have minor curls, bends or moderate to considerable highlighting/ writing. Binding is intact; however, spine may have heavy wear. A well-read copy overall. Please note that all items are donated goods and are in used condition. Orders shipped Monday through Friday! Your purchase helps put people to work and learn life skills to reach their full potential. Orders shipped Monday through Friday. Your purchase helps put people to work and learn life skills to reach their full potential. Thank you!
