Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. Electronic Packaging: Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders. The ...
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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. Electronic Packaging: Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders. The book also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
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Seller's Description:
Fair. An acceptable and readable copy. All pages are intact, and the spine and cover are also intact. This item may have light highlighting, writing or underlining through out the book, curled corners, missing dust jacket and or stickers.
