Electronic Packaging: Materials and Processes to Reduce Package Cycle Time and Improve Reliability: Proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge, Massachusetts, USA
Electronic Packaging: Materials and Processes to Reduce Package Cycle Time and Improve Reliability: Proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge, Massachusetts, USA
Add this copy of Electronic Packaging: Materials and Processes to Reduce to cart. $58.75, very good condition, Sold by Rob the Book Man rated 4.0 out of 5 stars, ships from Vancouver, WA, UNITED STATES, published 1992 by Materials Park, Ohio, U.S.A. : Asm Intl.
Add this copy of Electronic Packaging: Materials and Processes to Reduce to cart. $101.00, good condition, Sold by Dotcom liquidators / dc1 rated 4.0 out of 5 stars, ships from Fort Worth, TX, UNITED STATES, published 1992 by ASM International(OH).
Add this copy of Electronic Packaging: Materials and Processes to Reduce to cart. $106.41, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 1992 by Asm Intl.
