Comprehensively addresses both sintering and soldering, thereby comprehensively addressing principles, methods, and performance of high-temperature die-attach materials Emphasizes the industrial perspective with chapters writen by engineers who have hands-on experience using these technologies; Infineon Technologies, Bosch, ON Semiconductor, and Hughes Baker are represented as well as materials and equipment suppliers such as as Indium and Boschman & Locatelli Simultaneously provides the detailed science underlying these ...
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Comprehensively addresses both sintering and soldering, thereby comprehensively addressing principles, methods, and performance of high-temperature die-attach materials Emphasizes the industrial perspective with chapters writen by engineers who have hands-on experience using these technologies; Infineon Technologies, Bosch, ON Semiconductor, and Hughes Baker are represented as well as materials and equipment suppliers such as as Indium and Boschman & Locatelli Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field
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Add this copy of Die-Attach Materials for High Temperature Applications to cart. $196.87, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2019 by Springer.
