3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in ...
Read More
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Read Less
Add this copy of Design and Modeling for 3d Ics and Interposers (Wspc to cart. $133.15, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2014 by World Scientific Pub Co Inc.
Add this copy of Design and Modeling for 3d Ics and Interposers (Wspc to cart. $178.26, new condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2014 by World Scientific Pub Co Inc.
Add this copy of Design and Modeling for 3d Ics and Interposers to cart. $82.50, new condition, Sold by discount_scientific_books rated 3.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2013 by World Scientific Publishing Co Pte Ltd.
Add this copy of Design and Modeling for 3d Ics and Interposers to cart. $85.70, new condition, Sold by discount_scientific_books rated 3.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2013 by World Scientific Publishing Co Pte Ltd.
Add this copy of Design and Modeling for 3d Ics and Interposers to cart. $95.37, new condition, Sold by discount_scientific_books rated 3.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2013 by World Scientific Publishing Co Pte Ltd.
Add this copy of Design and Modeling for 3d Ics and Interposers to cart. $99.11, new condition, Sold by discount_scientific_books rated 3.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2013 by World Scientific Publishing Co Pte Ltd.
Add this copy of System Integration and Modeling Concepts; Modeling of to cart. $109.04, new condition, Sold by Media Smart rated 4.0 out of 5 stars, ships from Hawthorne, CA, UNITED STATES, published 2013 by World Scientific Publishing Company, Incorporated.
Add this copy of Design And Modeling For 3d Ics And Interposers to cart. $127.95, new condition, Sold by GreatBookPricesUK5 rated 4.0 out of 5 stars, ships from Castle Donington, DERBYSHIRE, UNITED KINGDOM, published 2013 by World Scientific Publishing Co Pte Ltd.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
New. Wspc Series In Advanced Integration And Packaging . Intended for college/higher education audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Design And Modeling For 3d Ics And Interposers to cart. $137.70, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2013 by World Scientific Publishing Co Pte Ltd.
