This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly used in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free ...
Read More
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly used in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
Read Less
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
This is a USED book, it is subject to external and interior wear including, underlining, highlighting, annotations, water damage, minor scuffs and tears. This is a donated book accepted as is. Stickers and sticker residue on the cover should be expected, as well as spine wear from use. There are NO codes or disc(s) included. All items ship Monday-Friday within 2-3 business days. Thank you for supporting Goodwill of OC.
